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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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2.00mm 8 Layers Gold Immersion FR4 High TG PCB Custom Printed Circuit Board

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2.00mm 8 Layers Gold Immersion FR4 High TG PCB Custom Printed Circuit Board

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : FR4

Layer : 8

Color : Green

Min line space : 4mil

Min line width : 4mil

Copper thickness : 1OZ

Board size : 200*75MM

Panel : 1

Surface : Immersion Gold

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2.00mm 8 layers Gold Immersion FR4 High TG PCB

Description:

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )


Parameter:

Product name FR4 PCB Double side 4 layer 6 layer 8 layer 10-28layer
layer Single side Double side 4 layer 6 layer 8 layer 10-28layer
Base Maerial FR4 FR4,Alu,polymide FR4 FR4 FR4 FR4
Copper thickness 1-6OZ
Min.Hole size 0.1mm
Min.Line Width 0.1mm
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color green,red,black,white,yellow
Silkscreen color black,white,yellow
Tolerance - Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements Buried and blind vias+controlled impedance +BGA

Layers 1-16 layers Min Board Thickness(2-layer) 0.2mm
Max Board Size 635 × 1100mm Min Board Thickness(4-layer) 0.6mm
Min Board Size 20 × 30mm Min Inner-layer Thickness 0.1mm
Min Trace 0.1mm Min Annular Ring 0.1mm
Min Space 0.1mm Min Hole Location Tolerance ±0.075mm
Min Hole Size 0.2mm Min Hole Size Tolerance ±0.05mm
Board Warp ≤ 1° Min Outer Dimension Tolerance ±0.1mm
Solder Mask Green, Yellow, Red, Black, Blue, White
Surface Finish HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
Acceptable file Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
CAM software Genesis, CAM350


Rigid PCB Manufacturing Capabilities

Total Pad Size Standard Advanced
Capture Pad Drill + 0.008 Drill + 0.006
Landing Pad Drill + 0.008 Drill + 0.006
BC Mechanical Drill (Type III) 0.008 0.006
Laser Drill Size 0.004-0.010 0.0025
Material Thickness 0.0035 0.0025
Stacked Via Yes Yes
Type I Capabilities single & Double Deep Yes Yes
Type II Capabilities Buried Vias with Microvias Yes Yes
Type III Capabilities Yes Yes
Copper Filled Microvia Yes Yes
Smallest Copper Filled Microvia 0.004 0.0025
Copper Filled Microvia Aspect Ratio 0.75:1 1:01
Smallest Laser Microvia Hole Size 0.004 0.0025
Laser Via Aspect Ratio (Depth:Diameter) 0.75:1 1:01




Product Tags:

pcb manufacturing process

      

fr4 circuit board

      
Quality 2.00mm 8 Layers Gold Immersion FR4 High TG PCB Custom Printed Circuit Board for sale

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