6 Layer Multilayer Pcb Board In Immersion Gold Finished Surface
Quick detail:
| Origin:China |
Special: FR4 Material |
| Layer:6 |
Thickness:1.6mm |
| Surface: ENIG |
Hole:0.8 |
Specification:
FR-4 material is a fire code rating, represents a material specification is meant a resin material through the combustion state must be self-extinguishing, it is not a material name, but a material grade. So now FR-4 grade material is typically used in circuit boards, there are many species, but most are based on the so-called four-function (Tera-Function) plus epoxy filler (Filler) and glass fiber made composite materials.
Typical Applications
- Cellular Base Station Antennas and Power Amplifiers
- Microwave point to point (P2P) links
- Automotive Radar and Sensors
- low dielectric loss
- Ballast, lights, navigation
- The stability of the dielectric constant
- An extremely low water imbibition
- IT industry,Keyboard products
FR-4 epoxy glass Burkina board, based on epoxy resin as the binder, the electronic-grade glass fiber cloth as a reinforcing material-based substrate. Its bonding sheet and the inner core thin CCL is an important base of manufacturing a multilayer printed circuit board.
Parameter:
| o |
Item |
Data |
| 1 |
Layer: |
1 to 24 layers |
| 2 |
Material type: |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 |
Board thickness: |
0.20mm to 3.4mm |
| 4 |
Copper thickness: |
0.5 OZ to 4 OZ |
| 5 |
Copper thickness in hole: |
>25.0 um (>1mil) |
| 6 |
Max. Board Size: |
(580mm×1200mm) |
| 7 |
Min. Drilled Hole Size: |
4mil(0.1mm) |
| 8 |
Min. Line Width: |
3mil (0.075mm) |
| 9 |
Min. Line Spacing: |
3mil (0.075mm) |
| 10 |
Surface finishing: |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 |
Solder Mask Color: |
Green/Yellow/Black/White/Red/Blue |
| 12 |
Shape tolerance: |
±0.13 |
| 13 |
Hole tolerance: |
PTH: ±0.076 NPTH: ±0.05 |
| 14 |
Package: |
Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 |
Certificate: |
UL,SGS,ISO 9001:2008 |
| 16 |
Special requirements: |
Buried and blind vias+controlled impedance +BGA |
| 17 |
Profiling: |
Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
| Brand |
Model |
Thickness(mm) |
DK(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO4003 |
0.254 0.508,0.813,1.524 |
3.38 |
| RO4350 |
0.254 0.508,0.762,1.524 |
3.5 |
| RO5880 |
0.254.0.508.0.762 |
2.2 |
| RO3003 |
0.127,0.508,0.762,1.524 |
3 |
| RO3010 |
0.635 |
10.2 |
| RO3206 |
0.635MM |
10.2 |
| R03035 |
0.508MM |
3.5 |
| RO6010 |
0.635MM, 1,27MM |
10.2 |
Product Tags:
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200*150mm Green Multi Layered Pcb In Immersion Gold Finished Surface Images
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