PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180
Specification:
| Base Material: FR4 |
| Layer:6 |
| Thickness: 1.0MM |
| Copper weight:1OZ |
| Surface finish: HASL |
Features:
Base Material: Aluminum/FR4/CEM1/CEM3
Layer: 1 layer/2 layers
Board Thickness: 0.3-3mm
Min.Board Dimension: 4x4mm
Max.Board Dimension: 1500x600mm
Copper layer: 1oz/2oz/3oz
Solder Mask: White/Black/Blue/Red
Silkscreen: Black/White
Surface finish: LF HAL/HAL/OSP/Gold immersion/Silver plating
Outline Profile: CNC routing/V-Cut/Punching
All of the parameters can be customized!
Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.
With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.
Parameter:
| Layer No. | 1-16 |
| Min board thickness | 2 layer 0.2mm |
| 4 layer 0.4mm |
| 6 layer 0.6mm |
| 8 layer 0.8mm |
| 10 layer 1.0mm |
| Max panel size | 508*610mm |
| Board thickness tolerance | T≥0.8mm±8%,T＜0.8mm±5% |
| Wall hole copper thickness | ＞0.025mm(1mil) |
| Finished hole | 0.2mm-6.3mm |
| Min line width | 4mil/4mil(0.1/0.1mm) |
| Min bonding pad space | 0.1mm(4mil) |
| PTH aperture tolerance | ±0.075mm(3mil) |
| NPTH aperture tolerance | ±0.05mm(2mil) |
| Hole site deviation | ±0.05mm(2mil) |
| Profile tolerance | ±0.10mm(4mil) |
| Board bend&warp | ≤0.7% |
| Insulation resistance | ＞1012Ωnormal |
| Through-hole resistance | ＜300Ωnormal |
| Electric strength | ＞1.3kv/mm |
| Current breakdown | 10A |
| Peel strength | 1.4N/mm |
| Soldmask regidity | ＞6H |
| Thermal stress | 288℃20Sec |
| Testing voltage | 50-300v |
| Min buried blind via | 0.2mm(8mil) |
| Outer cooper thickness | 1oz-5oz |
| Inner cooper thickness | 1/2 oz-4oz |
| Aspect ratio | 8:1 |
| SMT min green oil width | 0.08mm |
| Min green oil open window | 0.05mm |
| Insulation layer thickness | 0.075mm-5mm |
| Aperture | 0.2mm-0.6mm |
Product Tags:
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PCB Industrial Bare Circuit Board Fabrication 6 Layer High TG180 Images
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