Specification
- 2 layer
- Green solder mask,
- Model:XCEF
- Copper Thickness: 1OZ
- Location: Shenzhen
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (er) of the materials used.
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| PCB production capability |
| Files |
Gerber, Protel, Powerpcb, Autocad, Orcad, Eagle,etc. |
| Material |
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-
1, 94V0,Aluminium, High frequency Material (Rogers,
Teflon, Taconic)
|
| Layer No. |
1 - 28 Layers |
| Board thickness |
0.0075"(0.2mm)-0.125"(3.2mm) |
| Board Thickness Tolerance |
±10% |
| Copper thickness |
0.5OZ - 4OZ |
| Impedance Control |
±10% |
| Warpage |
0.075%-1.5% |
| Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
| Min Trace Width (a) |
0.005"(0.125mm) |
| Min Space Width (b) |
0.005"(0.125mm) |
| Min Annular Ring |
0.005"(0.125mm) |
| SMD Pitch (a) |
0.012"(0.3mm) |
| pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) |
0.027"(0.675mm) |
| Regesiter torlerance |
0.05mm |
| Min Solder Mask Dam (a) |
0.005"(0.125mm) |
| Soldermask Clearance (b) |
0.005"(0.125mm) |
| Min SMT Pad spacing (c) |
0.004"(0.1mm) |
| Solder Mask Thickness |
0.0007"(0.018mm) |
| Hole size |
0.01"(0.25mm)-- 0.257"(6.5mm) |
| Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
| Aspect Ratio |
6:01 |
| Hole Registration |
0.004"(0.1mm) |
| HASL |
2.5um |
| Lead free HASL |
2.5um |
| Immersion Gold |
Nickel 3-7um Au:1-3u'' |
| OSP |
0.2-0.5um |
| Panel Outline Tol (+/-) |
±0.004''(±0.1mm) |
| Beveling |
30°45° |
| V-cut |
15° 30° 45° 60° |
| Surface finish |
HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger,
immersion silver, immersion Tin, OSP, Carbon ink,
|
| Certificate |
ROHS ISO9001:2008 TS16949 SGS UL CE |
| Special requirements |
Buried and blind vias, Impedance control, via plug, BGA soldering
and gold finger
|
Materials used for HF circuit boards
For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.
Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.
We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Testing Service:X-Ray/AOI X-Ray Function Test/Omron AOI/Solder Paste Testing
Which widely be used for :
Automotive Antennas / RFID
Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability
Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital
High frequency:
| Model |
Parameter |
thickness(mm) |
Permittivity(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO5880 |
0.254 0.508 0.762 |
2.20 ± 0.02 |
| RO4350 |
0.254 0.508,0.8,1.524 |
3.5 |
| RO4003 |
0.508 |
3.38 |
| TACONIC |
TLF-35 |
0.8 |
3.5 |
| TLA-6 |
0.254,0.8,1,1.5, |
2.65 |
| TLX-8 |
0.254,0.8,1,1.6 |
2.55 |
| RF-60A |
0.64 |
6.15 |
| TLY-5 |
0.254,0.508,0.8 |
2.2 |
| TLC-32 |
0.8,1.5,3 |
3.2 |
| TLA-35 |
0.8 |
3.2 |
| ARLON |
AD255C06099C |
1.5 |
2.55 |
| MCG0300CG |
0.8 |
3.7 |
| AD0300C |
0.8 |
3 |
| AD255C03099C |
0.8 |
2.55 |
| AD255C04099C |
1 |
2.55 |
| DLC220 |
1 |
2.2
|
Advantage
1. PCB factory directly
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting
Our product range covers various fields, i.e. consumer electronics, telecommunications, industrial products, auto mobile assemblies, medical equipments etc.
Our main services include electronics and metal, casing manufacturing, such as PCB fabrication, component purchasing, PCB assembly, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.
Up to now, Xingchenger has over 500 employees based in China, with well-trained staffs and professional working attitudes, we believe our effective solutions can satisfy our customers’ needs through manufacturing expertise and a culture of continuous improvement. culture of continuous improvement.
